WhatIsTLP? (1) TLP Generator (4) Accessory (3)
Total 8
CC-TLP

The CC-TLP-50-A1 probearm is used for CC-TLP measurements
in order to investigate the CDM performance
of the device under test [1], [2], [3], [4], [5]. For
that purpose the TLP pulse has to have a pulse width
less than 1 ns and a rise time of about typical 100 ps.
DUT voltage and current have to be measured using a
vf-TLP setup.




Company Profile

High Power Pulse Instruments GmbH (HPPI) is a supplier of ESD
measurement equipment based on advanced Transmission Line Pulse
(TLP) techniques.

Our products enable the characterization of semiconductor devices and
circuits in the pulsed high current and high voltage time domain.

The development of our systems has profited largely from the knowledge
gained over 15 years in the development of semiconductor devices, i
ntegrated high speed and radio frequency circuits and ESD protection
techniques for the semiconductor industry.

Our products combine standard TLP, very fast TLP and Human Metal
Model (HMM) in a single test system to cover most of today's ESD characterization
needs.
 
What is TLP testing? 아래 데이터 시트를 클릭 해주세요.


80A High Current TLP/HMM Test System TLP-8010A
  • Wafer, package and system level TLP/HMM testing
  • Fast 50 Ω high voltage pulse output with typically 300 ps rise time
  • Up to 90 kW peak output power into 50 Ω load
  • Built-in HMM pulse up to ±16 kV with 100 Ω configuration
  • High pulse output current up to ±80 A (short circuit) with 6 dB reflection suppression
  • 6 GPIB programmable pulse rise times: 300 ps to 50 ns
  • 1 built-in pulse width: 2 ns plus 100 ns with one external charge line cable
  • Optional external pulse width extensions from 2 ns to 500 ns using the pulse width extender TLP-8012A5
  • Fast measurement time, typically 0.5 s per pulse including one-point DC measurement between pulses
  • Reverse recovery measurement capabilities in the range of ns up to µs
  • High-Voltage DMOS SOA measurements
  • Efficient MATLAB®-based software for system control and waveform data management
  • The software can control automatic probers for fast measurements of complete wafers
  • High performance and high quality components


  • Pulse Width Extender TLP-8012A5
    Features of the System

    • Pulse width extender for the 80A high current TLP/HMM
      test system TLP-8010A

    • 6 manual selectable pulse width: 5, 10, 50, 100,
      200 and 500ns


    80A High Current TLP/VF-TLP/HMM Test System TLP-8010C
  • Wafer, package and system level TLP/VF-TLP/HMM testing
  • Combines TLP-8010A and TLP-3010C into one system
  • Can be operated together with TLP-8012A5 and TLP-3011C
       pulse width extenders
  • Ultra fast 50 Ω high voltage pulse output with typical rise time
       100 ps (0-30 A) and 300 ps (> 30 A)
  • Up to 90 kW peak output power into 50 Ω load
  • Built-in HMM pulse up to ±16 kV with 100 Ω configuration
  • High pulse output current up to ±80 A (short circuit) with
       6 dB reflection suppression
  • High speed 50 Ω trigger output for oscilloscopes
       (synchronous to high voltage pulse output)
  • 6 GPIB programmable pulse rise times: 100 ps to 50 ns
  • 8 programmable pulse widths: 1 ns to 100 ns (0-30 A),
       1 built-in pulse width: 2 ns (> 30 A)
  • The optional pulse width extender TLP-3011C enables pulse
        width up to 1.6 µs in 68 GPIB programmable steps (0-30 A)
  • Optional external pulse width extensions from 2 ns to 500 ns
       (> 30 A) using the external pulse width extender TLP-8012A5
  • Fast measurement time, typically 0.5 s per pulse including one-point
       DC measurement between pulses
  • Reverse recovery measurement capabilities in the range of ns up to µs
  • High-Voltage DMOS SOA measurements
  • Efficient MATLAB®-based software for system control and waveform data management
  • The software can control automatic probers for fast measurements of complete wafers
  • High performance and high quality components


  • 30A TLP/VF-TLP/HMM Test System TLP-3010C/3011C
    Pulse System TLP-3010C/3011C for the following applications fields:

    • ESD robustness characterization on wafer-, chip- and board-level by TLP/vf-TLP/HMM pulse types
    • Safe-Operating-Area (SOA) measurements of active and passive devices from 1 ns to 1.6 µs pulse width
    • Reverse and forward recovery measurements of diodes from 200 ps to 1 µs
    • Breakdown and turn on/off characteristics of devices
    • Measurement of the impulse response

    Features of the System

    • Wafer and system level TLP/VF-TLP/HMM test system
    • Ultra fast 50 Ω pulse output with 100 ps rise time
    • Built-in HMM (IEC 61000-4-2) pulse up to ±8 kV
    • High pulse output current up to ±30 A
    • 6 programmable pulse rise-times: 100 ps to 45 ns
    • 8 programmable pulse widths: 1 ns to 100 ns
    • Optional pulse width extender increases pulse width up to 1.6 µs in 68 GPIB programmable steps
    • Fast measurement time, typically 0.5 s per pulse including one-point DC measurement between pulses
    • Efficient MATLAB®-based software for system control and waveform data management


    Precision Micromanipulator Kit for TLP/VF-TLP Wafer-Level Measurements PHD-3001A
    Pulse force and pulse sense RF probing solution for TLP/VF-TLP/HMM on-wafer measurements
  • High peak current capability 80 A (100 ns)
  • DC - 7 GHz bandwidth
  • Isolated probe-head ground shield for high pulse sense common mode signal rejection
  • True coaxial high-resolution 80:1 rotary probe-head for accurate probe tip adjustment


  • Portable Wafer Probe Station PS-5026A
  • Portable manual wafer probe station
  • Electrically isolated chuck with vacuum interface and wafer backside potential connector
  • 80x trinocular stereo zoom microscope
  • Ultra long-life 20000 lx white LED ring light
  • High reliability
  • Low cost